BoW Die to Die interface implementation: An open standardized interface for future Electronics

Chiplets with a Die to die interface has gained popularity over SoC recently since it has much scope for optimisation in terms of power consumption and high design cost. The downscaling of technology nodes has made it tough to increase the performance at system level. Systems such as automotive and associated needs a significant power for processing and has different blocks with different functionality. This presents the need for chiplets based system which leads to need for a standardized Die to Die interface. Bunch-of-Wire (BoW) is one open interface that can serve the needs well for the integration of heterogenous systems which is one of the primary advantage of this interface. This paper presents PHY implementation of this standard is done in 5nm Fin-FET and 22 nm FDX technology and an integration concept is also discussed.