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  4. Monitoring Direct Laser Interference Patterning of metallic substrates using an infrared camera system
 
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2023
Conference Paper
Title

Monitoring Direct Laser Interference Patterning of metallic substrates using an infrared camera system

Abstract
Direct Laser Interference Patterning (DLIP) is a technique that enables the fabrication of homogeneous microstructures in the micrometer and sub-micrometer range. Typically, the topography of these structures is evaluated ex-situ, using methods such as confocal microscopy or white light interferometry. However, these techniques are not suitable for real-time process observation due to their long measurement time. In this study, an Infrared camera system is used to explore the correlation between the captured average temperature during DLIP treatment and topographical parameters in real-time. The results show a linear relationship between the applied laser fluence (0.7 to 4.9 J/cm²) and the measured average temperature, as well as significant changes in surface roughness, skewness, and kurtosis within this fluence range. These findings suggest that the presented method could be used for in-situ indirect monitoring of topography during DLIP treatment, enabling quick identification of process fluctuations.
Author(s)
Olawsky, Lukas
ALOtec
Moghtaderifard, Stephan
TU Dresden  
Kuhn, Clemens
ALOtec
Lasagni, Andrés-Fabián  
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
Mainwork
Conference on Lasers in Manufacturing, LiM 2023  
Conference
Conference on Lasers in Manufacturing 2023  
Link
Link
Language
English
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
Keyword(s)
  • Direct Laser Interference Patterning

  • in-line monitoring

  • surface topography

  • infrared camera

  • System Engineering and Process Control

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