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20 April 2023
Video
Titel
A Chiplet Reference Platform Utilizing OCP Bunch-of-Wires
Abstract
In recent years System-on-Chips dominated the IC market with combining required functionality within one IC. The advantage is, that all functions are closely coupled and tightly integrated. But this leads to large ICs with reduced yield and the drawback, that all functionality has to be transferred to new nodes for a new generation, leading to very high development costs for advanced nodes. To overcome this chiplets are one way, to distribute blocks in different technologies and combine them together in a packaging solution. With that approach, the best suitable technology can be used for each part of the system. A latest FinFet or Gate-All-Around technology can be used for compute power and specialized RF nodes for wireless or radar functions. For vendor comprehensive usage, standardized interfaces are required. The presentation will deal with the OCP standard Bunch-of-Wires (BoW) and the usage within two different IC technologies, as well as the integration into an advanced package.