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  4. LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics
 
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2023
Conference Paper
Title

LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics

Abstract
The technology of low temperature cofired ceramics (LTCC) is already established in the production of reliable and robust electronic assemblies (e.g., multi-chip modules, system-in-package) as well as in safety-critical areas. With the incorporation of additional features based on surface profiles modular protection functions and barriers will be developed as a contribution to trustworthy electronics. Both obvious and hidden structures are investigated in a modular way, which in combination ensures a one-To-one tamper-proof identification.
Author(s)
Krieger, Uwe
VIA electronic GmbH
Schröter, Annett
VIA electronic GmbH
Bechtold, Franz
VIA electronic GmbH
Hagen, Gunter
KMS Technology Center GmbH
Goldberg, Adrian  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
24th European Microelectronics & Packaging Conference (EMPC 2023)  
Conference
European Microelectronics & Packaging Conference 2023  
DOI
10.23919/EMPC55870.2023.10418351
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Keyword(s)
  • embossing

  • LTCC

  • obvious and hidden structures

  • trustworthy electronics

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