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2023
Conference Paper
Title
LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics
Abstract
The technology of low temperature cofired ceramics (LTCC) is already established in the production of reliable and robust electronic assemblies (e.g., multi-chip modules, system-in-package) as well as in safety-critical areas. With the incorporation of additional features based on surface profiles modular protection functions and barriers will be developed as a contribution to trustworthy electronics. Both obvious and hidden structures are investigated in a modular way, which in combination ensures a one-To-one tamper-proof identification.
Author(s)