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  4. Methodology to Accurately Replicate a Non-Planar Thin-Film Microstrip BEOL in 3D EM Simulation
 
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2024
Conference Paper
Title

Methodology to Accurately Replicate a Non-Planar Thin-Film Microstrip BEOL in 3D EM Simulation

Abstract
In this paper, we present an EM design flow that seemlessly integrates the automated creation and usage of a conformal stack to explicitly replicate the topographical relief of non-planarized backend-of-line process using PathWave ADS. The tool is verified by the implementation of two 300 GHz quadrature couplers in the thin-film microstrip backend-of-line of a 35nm InGas mHEMT technology. The on-wafer measurements show excellent agreement with the simulated characteristics, with deviations of on average less than 0.5 dB in magnitude, and 5° in phase over the frequency range of interest from 250 to 330 GHz.
Author(s)
Wrana, Dominik
Universität Stuttgart  
Groetsch, Christopher
Keysight Technologies
Schoch, Benjamin
Universität Stuttgart  
Gebert, Lukas
Universität Stuttgart  
Ufschlag, Thomas
Universität Stuttgart  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Lozar, Roger  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Kallfass, Ingmar
Universität Stuttgart  
Mainwork
IEEE Radio and Wireless Symposium, RWS 2024  
Conference
Radio and Wireless Symposium 2024  
Radio and Wireless Week 2024  
DOI
10.1109/RWS56914.2024.10438595
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Circuit simulation

  • Software tools

  • MMICs

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