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  4. Comparison of Novel Charge-Based Wafer Inspection Technique to Optical Defect Mapping Techniques
 
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September 2023
Poster
Title

Comparison of Novel Charge-Based Wafer Inspection Technique to Optical Defect Mapping Techniques

Title Supplement
Poster presented at International Conference on Silicon Carbide and Related Materials, ICSCRM 2023, 17-22 September 2023, Sorrento, Italy
Author(s)
Karhu, Robin  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Nguyen, Sophia
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Albrecht, Kevin M.
Aixtron SE
Polisski, Gennadi
Semilab Germany GmbH
Wilson, Marshall
Semilab SDI
Kallinger, Birgit  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
International Conference on Silicon Carbide and Related Materials 2023  
File(s)
Download (617.19 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-2317
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Fraunhofer Group
Fraunhofer-Verbund Mikroelektronik  
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