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  4. Benchmarking Experiment of Substrate Quality Including SmartSiC™ Wafers by Epitaxy in a Batch Reactor
 
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2023
Book Article
Title

Benchmarking Experiment of Substrate Quality Including SmartSiC™ Wafers by Epitaxy in a Batch Reactor

Abstract
The feasibility of thin 4H-SiC layers bonded on an alternative carrier substrate for the application as substrate in SiC epitaxy is investigated. Epitaxial layers grown on such substrates are compared to those on state-of-the-art conventional substrates from different sources. The performance of the substrates is judged by the occurrence of killer defects in the epitaxial layer as analyzed using a PL scanning tool. Additional investigations on the material properties were carried out using X-ray topography and Atomic Force Microscopy, yielding information on the crystallinity, the lattice curvature, and the surface properties of the epitaxial layers.
Author(s)
Kallinger, Birgit  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Hens, Philip
Kranert, Christian  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Albrecht, Kevin M.
Erlekampf, Jürgen
Mainwork
Semiconductor Wafer Fabrication, Coatings and Tribology  
Project(s)
Trusted European SiC Value Chain for a greener Economy  
Funder
European Commission
Open Access
DOI
10.4028/p-av6tdz
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • Atomic Force Microscopy

  • Bonded Substrate

  • Engineered Substrate

  • Epitaxial Defects

  • Epitaxial Growth

  • Substrate

  • X-Ray Topography

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