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  4. Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils
 
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2022
Journal Article
Title

Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils

Abstract
Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bonding at chip-level. The design and optimization of the micro coil as well as the analysis of the heating process were carried out by means of finite element method (FEM). The micro coil is a composite material of an aluminum nitride (AlN) carrier substrate and embedded metallic coil conductors. The conductive coil geometry is generated by electroplating of 500 µm thick copper into the AlN carrier. By using the aforementioned micro coil for inductive Cu-Sn SLID bonding, a complete transformation into the thermodynamic stable ε-phase Cu3Sn with an average shear strength of 45.1 N/mm2 could be achieved in 130 s by applying a bond pressure of 3 MPa. In comparison to conventional bonding methods using conduction-based global heating, the presented inductive bonding approach is characterized by combining very high heating rates of about 180 K/s as well as localized heating and efficient cooling of the bond structures. In future, the technology will open new opportunities in the field of wafer-level bonding.
Author(s)
Hofmann, Christian
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Satwara, Maulik
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Kroll, Martin
Panhale, Sushant
Rochala, Patrick
Wiemer, Maik  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Hiller, Karla  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Kuhn, Harald  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Journal
Micromachines  
Open Access
DOI
10.3390/mi13081307
Additional full text version
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Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Keyword(s)
  • electromagnetic (EM) field

  • IMC

  • induction heating

  • intermetallic compound

  • localized heating

  • low-temperature bonding

  • MEMS packaging

  • micro coil

  • selective bonding

  • SLID bonding

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