The Impact of Different Hydrogen Configurations on Light- and Elevated-Temperature-Induced Degradation

In this article, the impact of different hydrogen configurations and their evolution on the extent and kinetics of light- and elevated-temperature-induced degradation (LeTID) is investigated in float-zone silicon via charge carrier lifetime measurements, low-temperature Fourier-transform infrared spectroscopy, and four-point-probe resistance measurements. Degradation conditions were light soaking at 77 °C and 1 sun-equivalent illumination intensity and dark anneal at 175 °C. The initial configuration of hydrogen is manipulated by varying the wafer thickness, the cooling ramp of the fast-firing process, and the dopant type (B- or P-doped). We find lower hydrogen concentrations in thinner samples and samples with a slower cooling ramp. This suggests that hydrogen diffuses out of the sample during the cool-down, which strongly affects the final concentration of hydrogen molecules H 2, and to a smaller degree the concentration of boron-hydrogen (BH) pairs. A regeneration of potential LeTID defects and a presumed LeTID degradation during dark annealing is found in n-type Si. In p-type Si, the LeTID extent was found to scale with H 2, suggesting a direct link between both. The temporal evolution of BH pairs, LeTID degradation/regeneration, and surface degradation depends on wafer thickness and the cooling ramp of the fast-firing process. Based upon these findings, we formulate a theory of the hydrogen-related mechanism behind LeTID: Hydrogen originating from H 2 moves between different temporary traps. First, hydrogen binds to LeTID precursors and acceptor atoms in the silicon bulk, later moving toward the surface. This leads first to the LeTID degradation and regeneration and then to the degradation of surface passivation.