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  4. Temperature Challenges for Integrated Systems due to High Power Density
 
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September 27, 2022
Presentation
Title

Temperature Challenges for Integrated Systems due to High Power Density

Title Supplement
Presentation held at Cluster-Schulung "Anwendertraining zur Wide-Bandgap Systemintegration", 2022
Author(s)
Schletz, Andreas  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Bayer, Christoph  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Hutzler, Aaron
Bond Pulse
Conference
Cluster-Schulung "Anwendertraining zur Wide-Bandgap Systemintegration"  
Open Access
File(s)
Download (3.64 MB)
Rights
CC BY-ND 4.0: Creative Commons Attribution-NoDerivatives
DOI
10.24406/publica-681
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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