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  4. A Read Circuit Design for Multi-Level RRAM Cells Exhibiting Small Resistance Windows
 
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2022
Conference Paper
Title

A Read Circuit Design for Multi-Level RRAM Cells Exhibiting Small Resistance Windows

Abstract
Memory integration is a key issue for emerging memory technologies. In order to properly integrate a novel memory technology, precise and reliable read circuits and concepts are necessary. But especially in emerging technologies, the electrical properties of the individual cells can vary widely, demanding additional flexibility. The presented circuit design offers a read circuit for RRAM cells based on voltage evaluation, that is able to resolve very small resistance ratios of up to 1.31 while offering multi-level capability. By changing some circuit parameters, it can be adopted to different given electrical properties.
Author(s)
Pechmann, Stefan
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Hagelauer, Amelie  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Mainwork
MWSCAS 2022, 65th IEEE International Midwest Symposium on Circuits and Systems. Symposium Proceedings  
Conference
International Midwest Symposium on Circuits and Systems 2022  
DOI
10.1109/MWSCAS54063.2022.9859436
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Keyword(s)
  • Resistance

  • Circuits and systems

  • Circuit synthesis

  • Integrated circuit reliability

  • Multi-Level

  • Read Circuit

  • Resistance Ratio

  • Resistive Random Access Memory

  • RRAM

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