Robust adhesive precision bonding of laser optics II
Presentation held at Conference "Components and Packaging for Laser Systems III", 28 January - 2 February 2017, San Francisco, California, United States, Published online only on SPIE Proceedings Volume 10085
Laser systems face massive economic challenges for cost effective, but yet ultraprecise assembly processes. Costs are mainly driven by the final assembly requirements of laser systems. Most challenging in this context is the robust process control of the UV-curing adhesive bonding process. The work presented aims for a significant reduction of the impact of shrinkage effects during curing and a resulting increase in assembly precision. Key approaches are integrated and characterized curing systems, ultraprecise dispensing processes and the automated characterization of adhesive shrinkage magnitude. These technologies allow for reproducible adhesive bonding processes in prototyping, job-shop assembly and automated assembly cells.