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  4. Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave Applications
 
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2022
Conference Paper
Title

Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave Applications

Abstract
In this paper, a compact wideband antenna-in-package (AiP) for 5G mmWave applications in the 39 GHz frequency band is presented. The proposed 1x2 antenna array consists of two identical patch antenna elements, which are designed, simulated and fabricated using a multilayer PCB substrate technology suitable for chip embedding. To improve the antenna bandwidth two U-shaped slots are etched in each patch element. The fabricated 1x2 U-slot patch antenna array exhibits a measured impedance bandwidth of 3 GHz at 39 GHz frequency band, and a measured peak gain of 8.8 dBi.
Author(s)
Le, Thi Huyen
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Ndip, Ivan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schwanitz, Oliver
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Kosmider, Stefan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Murugesan, Kavin Senthil
Technische Universität Berlin
Maaß, Uwe  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
16th European Conference on Antennas and Propagation, EuCAP 2022  
Project(s)
gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform  
Funding(s)
H2020  
Funder
European Commission  
Conference
European Conference on Antennas and Propagation 2022  
DOI
10.23919/EuCAP53622.2022.9769323
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • 39 GHz band

  • 5G mmWave

  • antenna-in-package (AiP)

  • mobile communication

  • wideband antenna

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