In-Package Ring Hybrid Coupler with On-chip Termination
Abstract
The aim of the paper is to demonstrate the feasibility of a chip-to-package co-design accounting for the chippackage copper pillar connection. Therefore, a 180° ring hybrid coupler was developed integrated in a wafer-level package with an on-chip termination for an application in the 60GHz WiGig range. Keywords-mm-wave communication, system-in-package, inpackage power divider, chip-package co-design.
