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  4. A 1-170-GHz Distributed Down-Converter MMIC in 35-nm Gate-Length InGaAs mHEMT Technology
 
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2022
Journal Article
Title

A 1-170-GHz Distributed Down-Converter MMIC in 35-nm Gate-Length InGaAs mHEMT Technology

Abstract
This letter demonstrates two distributed downconverter monolithic microwave integrated circuits (MMICs). MMIC1 contains a distributed down-conversion mixer and MMIC2 expands MMIC1 by an eight-cell distributed local oscillator (LO) driver amplifier. The letter includes an investigation of the optimal gate width for each of the transistors in the stack of the source-feedback mixer cells. The MMICs are fabricated in the Fraunhofer Institute for Applied Solid State Physics (IAF), Freiburg im Breisgau, Germany, 35-nm gate-length metamorphic high-electron-mobility transistor technology. MMIC2 achieves a conversion gain (CG) of better than -4.2 dB over a 1-170 GHz radio frequency (RF) bandwidth (BW) at a fixed intermediate frequency (IF) of 0.1 GHz. The LO power (PLO) of MMIC2 is only -1 dBm. Furthermore, the mixer has a variable gain feature. By adjusting PLO, the CG can be controlled without affecting the RF-input-power-related 1-dB CG compression of -1.7 dBm.To the best of the authors’ knowledge, this work demonstrates the largest BW for distributed down-conversion mixers and for distributed mixers (DMs) with a sliding LO.
Author(s)
Thome, Fabian  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Wagner, Sandrine  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Journal
IEEE microwave and wireless components letters  
Open Access
File(s)
Download (875.57 KB)
Rights
CC BY 4.0: Creative Commons Attribution
DOI
10.1109/LMWC.2022.3162762
10.24406/h-418613
Additional link
Full text
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Distributed amplifiers (DAs)

  • distributed mixers (DMs)

  • high-electron-mobility transistors (HEMTs)

  • metamorphic HEMTs (mHEMTs)

  • millimeter wave (mmW)

  • monolithic microwave integrated circuits (MMICs)

  • thin-film microstrip transmission lines (TFMSLs)

  • traveling-wave amplifiers (TWAs)

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