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  4. High-Gain 670-GHz Amplifier Circuits in InGaAs-on-Insulator HEMT Technology
 
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2022
Journal Article
Title

High-Gain 670-GHz Amplifier Circuits in InGaAs-on-Insulator HEMT Technology

Abstract
In this letter, we report on the development of highgain WR-1.5 amplifier circuits, utilizing a transferred-substrate InGaAs-on-insulator (InGaAs-OI) high-electron-mobility transistor (HEMT) technology on Si with 20-nm gate length. A six-stage and a nine-stage amplifier circuit are described, which are based on gain cells in cascode configuration. With more than 30 dB of measured gain in the frequency band of 660-700 GHz, the highest frequency of operation of transferred-substrate THz amplifiers is reported. These gain levels in excess of 30 dB, furthermore, correspond to the highest reported gain values and state-of-theart performance around the targeted 670-GHz frequency band.
Author(s)
John, Laurenz  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Tessmann, Axel  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Merkle, Thomas  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Maßler, Hermann
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Chartier, Sébastien
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Journal
IEEE microwave and wireless components letters  
Open Access
File(s)
Download (1.23 MB)
Rights
CC BY 4.0: Creative Commons Attribution
DOI
10.1109/LMWC.2022.3160093
10.24406/h-418611
Additional link
Full text
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Amplifiers

  • high-electron-mobility transistor

  • HEMT

  • InGaAs-on-insulator (InGaAs-OI)

  • silicon

  • THz

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