Silver Sintering on PCBs - Methods and Reliability

Conventional joining technologies like soldering or glueing are limited for the assembly of power semiconductors on PCB. This work describes two concepts for sintering of power semiconductors onto PCB. The principles of selective silver sintering and sinter paste jetting are discussed. Samples are fabricated utilizing both methods and power cycling tests are carried out to assess their reliability. Especially the jet printed samples show promising reliability results. No effect of the temperature cycles on surrounding components was observed.