• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Integrated high temperature electronics for sensors in harsh environments
 
  • Details
  • Full
Options
May 25, 2022
Conference Paper
Title

Integrated high temperature electronics for sensors in harsh environments

Abstract
As part of the Fraunhofer Lighthouse project "eHarsh" conducted by eight Fraunhofer institutes, a universal chipset was designed for the readout of sensors in harsh environments. The SOI-CMOS technology used was especially developed for high-temperature applications and allows operating temperatures of up to 300 °C. The chipset consists of an analogue sensor front-end IC for resistive sensors, a microcontroller and an interface IC. Measurements of the analog frontend IC show functional performance up to 300 °C and only a slight decrease of the measured SNR from 87 dB at 25 °C to 84 dB at high temperatures.
Author(s)
Kordas, Norbert  
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Kappert, Holger  
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Mainwork
Sensoren und Messsysteme 2022  
Conference
Fachtagung "Sensoren und Messsysteme" 2022  
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • harsh environments

  • high temperature electronics

  • SOI-CMOS

  • sensor readout

  • raue Umgebungsbedingungen

  • Hochtemperatur-Elektronik

  • Sensorauslese

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024