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  4. RF small-signal modeling of HCI degradation in FDSOI NMOSFET using BSIM-IMG
 
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2021
Conference Paper
Title

RF small-signal modeling of HCI degradation in FDSOI NMOSFET using BSIM-IMG

Abstract
The increasing demand for reliable CMOS devices in high-frequency applications brings new challenges in the modeling of aging effects in transistors, with the need to also capture degradation of RF performance. In this paper, we explore the possibilities of using BSIM-IMG parameters to model HCI degradation under DC stress on a 22FDXTM FDSOI n-channel transistor. First, a selection of parameters is used to model HCI degradation and its impact on RF performance is analyzed. Furthermore, the ""extension resistance model"" within BSIM-IMG is used to broaden the model possibilities to capture RF performance degradation.
Author(s)
Velarde Gonzalez, Fabio A.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Lange, André  orcid-logo
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Chohan, Talha
NaMLab gGmbH Dresden, Germany
Mikolajick, Thomas
Technische Universität Dresden  
Mainwork
IEEE International Integrated Reliability Workshop, IIRW 2021  
Project(s)
ARAMID
Funder
European Commission EC  
Conference
International Integrated Reliability Workshop (IIRW) 2021  
Open Access
File(s)
Download (1.46 MB)
Rights
Use according to copyright law
DOI
10.1109/IIRW53245.2021.9635622
10.24406/publica-r-417271
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Keyword(s)
  • HCI

  • FDSOI

  • RF reliability

  • S-parameters

  • BSIM-IMG

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