Reliability Study on Spring Interconnections for Piezo-Jet Printed Electronics Under Environmental Stress

In the current paper the reliability of spring interconnections for the use in automotive applications was investigated. A commercially available connector was used for contacting a piezo-jet printed silver pad on polycarbonate. The structures were tested using vibration tests at three different temperatures (-25°C, 25°C and 85°C) and measured using four-point probe measurement system and white light spectrometry. The obtained results showed the reliability of the printed structure and the contact, despite of the contact resistance change. The reasons of this change and experimental results are discussed in the paper. The investigations described in the paper provide an initial approach to the development of spring interconnections for printed electronics.