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  4. High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components
 
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2021
Conference Paper
Title

High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

Abstract
The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.
Author(s)
Laskin, Gennadii  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Huai, Haosu
Univ. Freiburg
Fratz, Markus  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Seyler, Tobias  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Beckmann, Tobias
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Schiffmacher, Alexander
Univ. Freiburg
Bertz, Alexander  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Wilde, Jürgen
Univ. Freiburg
Carl, Daniel  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Mainwork
Optical Measurement Systems for Industrial Inspection XII  
Conference
Conference "Optical Measurement Systems for Industrial Inspection" 2021  
Open Access
File(s)
Download (4.36 MB)
Rights
Use according to copyright law
DOI
10.1117/12.2592024
10.24406/publica-r-411365
Language
English
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Keyword(s)
  • ESPI

  • speckle interferometry

  • Interferometric Imaging

  • digital holography

  • Real-Time Deformation Measurement

  • inline inspection

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