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2021
Conference Paper
Titel
Me-DLC based strain sensitive materials
Titel Supplements
Abstract
Abstract
Sensors are essential component of the digitalization (Internet of Things, Industry 4.0, EL). There are challenges arising in integrating sensors in existing workpieces and machines. Besides the integration boosting the sensitivity is an essential challenge. In the case of strain gauges a gauge factor of 2 is standard. Increasing the sensitivity mostly is connected with higher thermal sensitivity of the investigated materials. Furthermore, the applied process can influence the performance of the sensing materials. Therefore, this contribution will address development of metal containing diamond-like carbon films for strain sensing films with enhanced sensitivity while at the same time considering the thermal coefficient of resistance. As best solution a highly strain sensitive film with low or no thermal sensitivity is desired.
Author(s)