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State of the Art Packaging
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2021
Presentation
Title
State of the Art Packaging
Title Supplement
Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021
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Author(s)
Schletz, Andreas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Endruschat, Achim
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Heckel, Thomas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Conference
Tutorial "Wide-Bandgap User Training" 2021
DOI
10.24406/publica-fhg-411241
File(s)
N-635221.pdf (4.06 MB)
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Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Keyword(s)
SiC power modules
GaN
power electronics packaging
