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  4. Investigation of Integrated mmW-Downconverter VCOs in SiGe for Offset-PLL FMCW-Transceivers
 
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2020
Conference Paper
Title

Investigation of Integrated mmW-Downconverter VCOs in SiGe for Offset-PLL FMCW-Transceivers

Abstract
This paper presents and compares two inherently different LC-VCO architectures for the down-conversion in a offset-PLL. The cross-coupled VCO architecture, which is unpopular in mmW SiGe applications, is compared to the commonly used Colpitts architecture. The two VCOs are fabricated with a supply voltage of 3.3 V in a modern 130 nm SiGe BiCMOS technology with HBTs offering an fT of 250 GHz and fmax of 370 GHz. For easier characterization and stabilization in a PLL the same static divide-by-4 chain is added to both VCO chips. The main purpose of this work is the integration of a VCO as a downconverter for a offset-PLL with good phase noise and low power consumption at the same time. At an offset of 1 MHz the Colpitts VCO achieves a phase noise of -108 dBc/Hz at 56 GHz and the cross-coupled VCO achieves a phase noise of -100 dBc/Hz at 68 GHz, respectively. Relative frequency tuning ranges (rFTR) of 26% for the Colpitts type and 43.7% for the cross-coupled VCO are reached.
Author(s)
Bredendiek, C.
Aufinger, K.
Pohl, N.
Mainwork
IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2020  
Conference
Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) 2020  
DOI
10.1109/SIRF46766.2020.9040181
Language
English
Fraunhofer-Institut für Hochfrequenzphysik und Radartechnik FHR  
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