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2018
Conference Paper
Title

All Copper NICE Modules

Abstract
In this work the first All Copper NICE (New Industrial Solar Cell Encapsulation) modules with solder-freeribbon to finger interconnections are presented. Experiments were conducted to investigate if silver can be fully omitted from solar cells with copper plated fingers in combination with the NICE module technology. We could show that silver flash plating, front and rear silver busbars or pads can be omitted without compromising series resistance or module performance. All Copper NICE modules were manufactured with fillfactors up to 76.8 %.
Author(s)
Reinwand, Dirk  
Pysch, D.
Bay, Norbert
Burschik, J.
Kuehnlein, H.H.
Madon, F.
Einhaus, R.
Brand, Andreas  
Arya, Varun  
Smith, B.
Richter, D.
Kray, Daniel
Mainwork
IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018  
Conference
World Conference on Photovoltaic Energy Conversion (WCPEC) 2018  
Photovoltaic Specialists Conference (PVSC) 2018  
Photovoltaic Science and Engineering Conference (PVSEC) 2018  
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2018  
DOI
10.1109/PVSC.2018.8547749
Language
English
Fraunhofer-Institut für Solare Energiesysteme ISE  
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