2019
Conference Paper
Title

3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring

Abstract
This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.
Author(s)
Köck, A.
Materials Center Leoben Forschung GmbH, Leoben, AUSTRIA
Wimmer-Teubenbacher, R.
Materials Center Leoben Forschung GmbH, Leoben, AUSTRIA
Sosada-Ludwikovska, F.
Materials Center Leoben Forschung GmbH, Leoben, AUSTRIA
Rohracher, K.
ams AG, Unterpremstaetten, AUSTRIA
Wachmann, E.
ams AG, Unterpremstaetten, AUSTRIA
Herold, M.
ams Sensor Solutions Germany GmbH, Reutlingen, GERMANY
Welden, T. an
Boschman Technologies BV, Ex Duiven, THE NETHERLANDS
Kim, J.M.
University of Oxford, Oxford, UK
Ali, Z.
ams Sensor UK Ltd., Cambridge, UK
Poenninger, A.
EVGroup, St. Florian, AUSTRIA
Stahl-Offergeld, M.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Hohe, H.-P.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Lorenz, J.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Erlbacher, T.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Dolmans, G.
Stichting IMEC, Eindhoven, THE NETHERLANDS
Offermans, P.
Stichting IMEC, Eindhoven, THE NETHERLANDS
Vandecasteele, M.
Stichting IMEC, Eindhoven, THE NETHERLANDS
Yurchenko, O.
University of Freiburg, Freiburg, GERMANY
Sicard, O. von
Siemens AG, Munich, GERMANY
Pohle, R.
Siemens AG, Munich, GERMANY
Udrea, F.
University of Cambridge, Cambridge, UK
Falco, C.
University of Cambridge, Cambridge, UK
Flandre, D.
Université Catholique de Louvain, Louvain-La-Neuve, BELGIUM
Bol, D.
Université Catholique de Louvain, Louvain-La-Neuve, BELGIUM
Comini, E.
Universita Degli Studi di Brescia, Brescia, ITALY
Zappa, D.
Universita Degli Studi di Brescia, Brescia, ITALY
Gardner, J.
University of Warwick, Coventry, UK
Cole, M.
University of Warwick, Coventry, UK
Theunis, J.
VITO NV, Mol, BELGIUM
Peters, J.
VITO NV, Mol, BELGIUM
Baldwin, A.
Samsung R&D Institute UK, Staines, UK
Mainwork
Conference
DOI
Language
English
Keyword(s)