Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications

For harsh environment sensors, especially high-temperature sensors are a great demand worldwide. The field of active sensor technology is already well developed thanks to established microsystem technologies. A core challenge, however, often still exists in the field of interconnection technology (ICT). Only a few systems are available on the market that can withstand temperatures of up to 500 °C and guarantee reliable signal transmission. In this paper, a new technology approach is analysed in order to flexibly implement reliable and cost-effective ICT for high-temperature sensors.