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  4. Advances with Resist-Free Copper Plating Approaches for the Metallization of Silicon Heterojunction Solar Cells
 
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2019
Conference Paper
Titel

Advances with Resist-Free Copper Plating Approaches for the Metallization of Silicon Heterojunction Solar Cells

Abstract
The metallization of silicon heterojunction (SHJ) solar cells by selective Cu electroplating without any resist-mask is in development. A thin multi-functional PVD Cu-Al stack is deposited to mask the ITO and to promote homogeneous current distribution for simultaneous bifacial plating. This investigation reviews different approaches to perform the Al-patterning - by printing of a metallic ink, laser metal transfer or selective metal etching - to produce a metal-seed susceptible to plate selectively against the self-passivated Al surface. This NOBLE - native oxide barrier layer for selective electroplated, metallization allows reaching a first promising efficiency of 20.0% on a full area SHJ solar cell with low contact resistivity to ITO. This simultaneous bifacial metallization features several advantages: low temperature processing, high metal conductivity of plated copper, no organic masking and low material costs (almost Ag free).
Author(s)
Hatt, Thibaud
Fraunhofer-Institut für Solare Energiesysteme ISE
Bartsch, Jonas
Fraunhofer-Institut für Solare Energiesysteme ISE
Franzl, Yannick
Fraunhofer-Institut für Solare Energiesysteme ISE
Kluska, Sven
Fraunhofer-Institut für Solare Energiesysteme ISE
Glatthaar, Markus
Fraunhofer-Institut für Solare Energiesysteme ISE
Hauptwerk
8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells 2019. Proceedings
Project(s)
DISC
Funder
European Commission EC
Konferenz
Workshop on Metallization & Interconnection for Crystalline Silicon Solar Cells 2019
DOI
10.1063/1.5125875
File(s)
N-562171.pdf (667.96 KB)
Language
English
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Fraunhofer-Institut für Solare Energiesysteme ISE
Tags
  • Plating

  • silicon hetero junction solar cell

  • TCOs

  • Photovoltaik

  • Silicium-Photovoltaik

  • Metallisierung und Strukturierung

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