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  4. On the Origin of Charge Compensation in Aluminum-Implanted n-Type 4H-SiC by Analysis of Hall Effect Measurements
 
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2019
Conference Paper
Title

On the Origin of Charge Compensation in Aluminum-Implanted n-Type 4H-SiC by Analysis of Hall Effect Measurements

Abstract
Aluminum implanted 4H-SiC often shows an unexpected increase of the free hole density at elevated temperatures in Hall Effect measurements. Here, we exhibit that this phenomenon cannot solely be traced down to the Hall scattering factor and the presence of excited acceptor states. It is necessary to assume an additional defect center in the lower half of the band gap with ionization energies higher than that of aluminum to explain this behavior. Therefore, we investigated ionimplanted square van-der-Pauw samples with Hall Effect and complementary SIMS measurements. An analysis of the data using the neutrality equation reveals compensation ratios of 20 % to 90 %, depending on the aluminum concentration and the concentration of the deep defect center of up to 50 % of the doping.
Author(s)
Weisse, Julietta
Chair of Electron Devices, Department Elektrotechnik-Elektronik-Informationstechnik, Friedrich-Alexander-Universität Erlangen-Nürnberg
Hauck, Martin
Lehrstuhl für Angewandte Physik, Department Physik, Friedrich-Alexander-Universität Erlangen-Nürnberg
Sledziewski, Tomasz
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Krieger, Michael
Lehrstuhl für Angewandte Physik, Department Physik, Friedrich-Alexander-Universität Erlangen-Nürnberg
Bauer, A.J.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mitlehner, Heinz
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Frey, Lothar
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
Silicon Carbide and Related Materials 2018  
Conference
European Conference on Silicon Carbide and Related Materials (ECSCRM) 2018  
DOI
10.4028/www.scientific.net/MSF.963.433
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • hall effect

  • compensation

  • activation

  • ionization energy

  • aluminum implantation

  • high temperature implantation

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