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Future Packaging Technologies in Power Electronic Modules
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2019
Presentation
Title
Future Packaging Technologies in Power Electronic Modules
Title Supplement
Presentation held at 31st Annual Electronics Packaging Symposium, Binghampton, New York, September 5-6, 2019
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Author(s)
Bayer, Christoph Friedrich
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Conference
Annual Electronics Packaging Symposium 2019
DOI
10.24406/publica-fhg-405270
File(s)
N-559183.pdf (3.18 MB)
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Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB