2019
Presentation
Title

SIC device manufacturing using ion implantation. Opportunities and challenges

Title Supplement
Presentation held at KTH IEEE Seminar, Stockholm, Sweden, 23.05.2019
Author(s)
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
DOI
File(s)
Rights
Under Copyright
Language
English
Keyword(s)