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  4. SIC device manufacturing using ion implantation. Opportunities and challenges
 
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2019
Presentation
Title

SIC device manufacturing using ion implantation. Opportunities and challenges

Title Supplement
Presentation held at KTH IEEE Seminar, Stockholm, Sweden, 23.05.2019
Author(s)
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
File(s)
Download (3.12 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-404612
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • SIC-Microelectronic

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