Electrical Characterization of a High Speed HBM Interface for a Low Cost Interposer

The demand for higher data rates is still ongoing. But the physical laws are limiting the recent approach of using higher and higher speeds. This leads to a switch from very high-speed on a limited number of ports to reduced speed but with much more ports in parallel. One example for doing this is the High-Bandwidth-Memory (HBM). The paper presents the results of a topology evaluation and the simulations results of the HBM interface to and ASIC across a low cost interposer. Furthermore the design process for a silicon interposer using an Assembly Design Kit is presented. Based on the simulation and the developed design process a system with an ASIC and 8 HBM dies assembled on an interposer was built.