2018
Presentation
Title

Packaging and board design for 5G and millimeter wave applications

Title Supplement
Presentation held at User2User Europe - Mentor User Conference, November 26, 2018, Munich, Germany
Author(s)
Heinig, Andy  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Conference
DOI
File(s)
Rights
Under Copyright
Language
English
Keyword(s)