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  4. Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples. Numerical investigation
 
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2018
Poster
Title

Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples. Numerical investigation

Title Supplement
Poster presented at ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark, October 1-5, 2018
Author(s)
Simon, Flaviu-Bogdan
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2018  
File(s)
Download (1 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-401881
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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