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  4. Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples. Numerical investigation
 
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2018
Poster
Title

Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples. Numerical investigation

Title Supplement
Poster presented at ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark, October 1-5, 2018
Author(s)
Simon, Flaviu-Bogdan
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2018  
DOI
10.24406/publica-fhg-401881
File(s)
Download (1 MB)
Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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