2017
Conference Paper
Title

Study of a laser packaging technique simulated with ANSYS and virtuallab fusion software

Abstract
Mechanico-optical simulations performed with ANSYS and VirtualLab Fusion software to analyze stress-induced birefringence for the packaging of a laser ignition device by a low-stress soldering technique showed almost no influence on the laser output beam.
Author(s)
Ribes-Pleguezuelo, P.
Zhang, S.
Beckert, E.
Eberhardt, R.
Wyrowski, F.
Tünnermann, A.
Mainwork
Conference
DOI
Language
English