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  4. New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"
 
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2017
Konferenzbeitrag
Titel

New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"

Abstract
We present a new approach to realize a cost effective mobile electrostatic carrier technology that is supposed to enable high temperature processes performed at very thin or fragile semiconductor wafers. The new E-Foil concept uses roll-to-roll manufacture of electrode patterns on film substrates and allows for re-charging during a semiconductor wafer process. E-Foil carriers with both fine line interdigitated electrodes and large electrode areas were prepared at Fraunhofer EMFT and first results are presented in the paper. We suggest E-Foil carrier systems as unique solution for plasma dicing of ultra-thin device wafers.
Author(s)
Landesberger, Christof
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Bose, Indranil
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
König, Martin
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Kutter, Christoph
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Hauptwerk
WaferBond 2017, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts
Konferenz
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) 2017
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Englisch
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EMFT
Tags
  • mobile electrostatic ...

  • e-carrier

  • thin wafer handling

  • thinwafer processing

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