New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"

We present a new approach to realize a cost effective mobile electrostatic carrier technology that is supposed to enable high temperature processes performed at very thin or fragile semiconductor wafers. The new E-Foil concept uses roll-to-roll manufacture of electrode patterns on film substrates and allows for re-charging during a semiconductor wafer process. E-Foil carriers with both fine line interdigitated electrodes and large electrode areas were prepared at Fraunhofer EMFT and first results are presented in the paper. We suggest E-Foil carrier systems as unique solution for plasma dicing of ultra-thin device wafers.