2018
Presentation
Title

Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out

Title Supplement
Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018
Author(s)
Schletz, Andreas  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
DOI
File(s)
Rights
Under Copyright
Language
English
Keyword(s)