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  4. Advanced sensor systems by low-temperature heterogeneous 3D integration processes
 
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2018
Conference Paper
Title

Advanced sensor systems by low-temperature heterogeneous 3D integration processes

Abstract
A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.
Author(s)
Fernandez-Bolanos, Montserrat
EPFL
Muller, Andrei
EPFL
Weber, Josef  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Ramm, Peter  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Mainwork
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP 2018  
Project(s)
NEREID  
Funder
European Commission EC  
Conference
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2018  
Open Access
File(s)
Download (6.32 MB)
Rights
Use according to copyright law
DOI
10.1109/DTIP.2018.8394203
10.24406/publica-r-400874
Additional link
Full text
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Keyword(s)
  • 3D integration

  • advanced sensor systems

  • heterogeneous integration

  • low-temperature bonding

  • Through Silicon Vias (TSV)

  • Solid-Liquid Interdiffusion (SLID)

  • FET-based sensors

  • CNT-based gas sensor

  • Heterogeneous 3D Integration

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