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2018
Konferenzbeitrag
Titel

Advanced sensor systems by low-temperature heterogeneous 3D integration processes

Abstract
A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.
Author(s)
Fernandez-Bolanos, Montserrat
EPFL
Muller, Andrei
EPFL
Weber, Josef
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Hauptwerk
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP 2018
Project(s)
NEREID
Funder
European Commission EC
Konferenz
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2018
DOI
10.1109/DTIP.2018.8394203
File(s)
N-503246.pdf (6.32 MB)
Language
Englisch
google-scholar
EMFT
Tags
  • 3D integration

  • advanced sensor syste...

  • heterogeneous integra...

  • low-temperature bondi...

  • Through Silicon Vias ...

  • Solid-Liquid Interdif...

  • FET-based sensors

  • CNT-based gas sensor

  • Heterogeneous 3D Inte...

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