2018
Conference Proceeding
Title

Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP 2018

Title Supplement
Roma, Italy, May 22nd - May 25th, 2018
Person Involved
Mailly, Frédérick
LIRMM, University of Montpellier, France
Marcelli, Romolo
CNR-IMM, Roma, Italy
Mita, Yoshio
University of Tokyo, Japan
Nouet, Pascal
LIRMM, University of Montpellier, France
Pressecq, Francis
CNES, France
Schneider, Peter  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Smith, Steward
University of Edinburgh, Scotland
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Conference
Language
English