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  4. Environmental-friendly fluorine mixture for CVD cleaning processes to replace C2F6, CF4 and NF3
 
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2016
Conference Paper
Title

Environmental-friendly fluorine mixture for CVD cleaning processes to replace C2F6, CF4 and NF3

Abstract
The target of this work was to find viable alternative CVD-cleaning gas mixtures for the semiconductor industry, which are environmental-friendly and in addition can be used as a "drop in" to avoid high investment costs from equipment modification. Our study has demonstrated that this can be achieved with F2-based gas mixtures, which also provide a more efficient and faster cleaning behavior for most applications. A cleaning efficiency gain of a factor 1.3 up to 17 can be expected, relative to the F2-amount required for cleaning. This gain in efficiency depends on the cleaning gas to be replaced and on the reactor type. A shorter cleaning time can lead into a higher equipment throughput and more cost effective usage of thin film tools. To generate data on particle and tool attrition, a first "mini marathon" test run has been performed. The test reactor, a 200mm wafer size CVD tool, was equipped with a mass spectrometer to monitor the end point of the chamber cleaning an d to gain an overview of the waste gases going into the abatement system.
Author(s)
Wieland, R.
Pittroff, M.
Boudaden, J.
Altmannshofer, S.
Kutter, C.
Mainwork
Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing  
Conference
Symposium Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing 2016  
Electrochemical Society (ECS Meeting) 2016  
DOI
10.1149/07219.0023ecst
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
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