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  4. Contamination control for wafer container used within 300 mm manufacturing for power microelectronics
 
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2016
Conference Paper
Title

Contamination control for wafer container used within 300 mm manufacturing for power microelectronics

Abstract
This paper gives an overview about all activities performed within a common project between industrial and academic partners to define clean room concepts for the first worldwide high volume semiconductor front end facility IFD for 300 mm power semiconductors. The investigation within this study is the base for the 300 mm container strategy resulting in new innovative manufacturing and automation concepts. © 2016 Trans Tech Publications, Switzerland.
Author(s)
Schneider, G.
Nguyen, T.Q.
Taubert, M.
Bounouar, J.
Le-Guet, C.
Leibold, A.
Richter, H.
Pfeffer, M.  
Mainwork
Ultra clean processing of semiconductor surfaces XIII  
Conference
International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) 2016  
DOI
10.4028/www.scientific.net/SSP.255.381
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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