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Mechanical stress induced in Si sensors during bonding and packaging processes
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2015
Conference Paper
Title
Mechanical stress induced in Si sensors during bonding and packaging processes
Author(s)
Rost, F.
Schindler-Saefkow, Florian
Schaufuß, J.
Vogel, D.
Michel, Bernd
Mehner, J.
Rzepka, Sven
Mainwork
Smart Systems Integration 2015
Conference
Smart Systems Integration Conference (SSI) 2015
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2015
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
