• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation
 
  • Details
  • Full
Options
2016
Conference Paper
Title

Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation

Abstract
Partial discharge (PD) is a key degradation mechanism of insulating materials such as ceramics in power modules. Among others, this is due to high voltages under operation of the modules. PD is due to high electric field strengths in the vicinity of the edge of the metallization of the insulating substrate e.g. direct copper bond (DCB). This paper focusses on the encapsulating fluid or gel that influences the partial discharge inception voltage (PDIV) due to its electrical properties. Simulations of the electric field strength were carried out to analyze the effect of the permittivity of the covering fluid. The simulations show a reduction of the electric field strength at the edge of the metallization with increasing relative permittivity. Phase resolved partial discharge (PRPD) measurements were carried out on different ceramic layouts using two inert fluids with different relative permittivity. The results show higher PDIVs for the higher permittivity of the encapsulating liquid. Further investigations were done to study the effect of aging on the electrical properties of a commonly used silicone gel for covering power devices.
Author(s)
Bayer, Christoph Friedrich  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Waltrich, Uwe
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Soueidan, Amal
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Schneider, Richard
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Bär, Eberhard  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Schletz, Andreas  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
CIPS 2016, 9th International Conference on Integrated Power Electronics Systems. Proceedings. CD-ROM  
Conference
International Conference on Integrated Power Electronics Systems (CIPS) 2016  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • partial discharge

  • direct bonded copper substrate

  • phase-resolved partial discharge measurement

  • partial discharge inception voltage

  • field strength simulation

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024