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2016
Presentation
Title

Drill-down analysis with equipment health monitoring

Title Supplement
Presentation held at 16th European Advanced Process Control and Manufacturing Conference, APCM 2016, April 11 - 13, 2016, Reutlingen, Germany
Abstract
This presentation deals with a procedure to track the current equipment state and to identify underperforming parameters. The approach concentrates on the autonomous classification of different process variable types which are defined by particular variable behaviors and the investigation of specified statistical feature extraction methods for every respective class. Also the computation of the Equipment Health Factor (EHF) is presented. The expected benefit of the implementation of an EHF application is the optimization of lot and wafer measurement sampling.
Author(s)
Krauel, Christopher
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Weishäupl, Laura
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Pfeffer, Markus  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
European Advanced Process Control and Manufacturing Conference (APCM) 2016  
DOI
10.24406/publica-fhg-391928
File(s)
Download (1.04 MB)
Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • monitoring

  • Equipment Health Factor (EHF)

  • semiconductor

  • condition monitoring

  • key feature extraction

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