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  4. Simulation of plasma immersion ion implantation into silicon
 
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2015
Conference Paper
Title

Simulation of plasma immersion ion implantation into silicon

Abstract
A numerically efficient model for the simulation of ion implantation doping profiles in silicon after pulsed plasma immersion ion implantation is suggested. The model is based on an analytical formula for the energy distribution of the ions extracted from the plasma and on the application of this energy distribution in a Monte-Carlo simulator for conventional ion implantation. The model is verified using examples of BF 3 and AsH 3 plasmas for p-type and n-type doping in silicon, respectively.
Author(s)
Burenkov, A.  
Lorenz, J.  
Spiegel, Y.
Torregrosa, F.
Mainwork
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2015  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2015  
DOI
10.1109/SISPAD.2015.7292298
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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