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  4. Robust double-ring junction termination extension design for high voltage power semiconductor devices based on 4H-SiC
 
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2015
Conference Paper
Title

Robust double-ring junction termination extension design for high voltage power semiconductor devices based on 4H-SiC

Abstract
In this study, a new robust double-ring junction-termination-extension (DR-JTE) for high-voltage pn-diodes is presented and analyzed using numerical simulations. As figured out, the DR-JTE reduces the electrical field at both, the edge of the single-JTE region and the MESA-transition, respectively. Thereby, due to the reduction of the electrical field, the maximum breakdown voltage is increased to 91.5% of the theoretical, parallel-plane breakdown voltage of 6.5kVand the maximum acceptable deviation of the optimum implantations dose is twice than that of the single-JTE structure. Furthermore, due to the internal ring, the MESA-transition is shielded from the electrical field and therefore the breakdown voltage is much less affected by the angle of the MESA.
Author(s)
Hürner, A.
Benedetto, L. di
Erlbacher, T.  
Mitlehner, H.
Bauer, A.J.
Frey, L.
Mainwork
Silicon Carbide and Related Materials 2014  
Conference
European Conference on Silicon Carbide and Related Materials (ECSCRM) 2014  
DOI
10.4028/www.scientific.net/MSF.821-823.656
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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