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2015
Conference Paper
Title

Hierarchical variability-aware compact models of 20nm bulk CMOS

Abstract
This paper presents a hierarchical variability-aware compact model methodology based on a comprehensive simulation study of global process variation and local statistical variability on 20nm bulk planar CMOS. The area dependence of statistical variability is carefully examined in the presence of random discrete dopants; gate line edge roughness; metal gate granularity; and their combination. Hierarchical variability-aware compact models have been developed, extracted and used to evaluate the impact of process variation and statistical variability on SRAM stability and performance.
Author(s)
Wang, Xingsheng
Reid, D.
Wang, Liping
Burenkov, A.  
Millar, C.
Lorenz, J.  
Asenov, A.
Mainwork
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2015  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2015  
DOI
10.1109/SISPAD.2015.7292325
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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