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  4. Impact of fabrication process on electrical properties and on interfacial density of states in 4H-SiC n-MOSFETs studied by hall effect
 
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2014
Conference Paper
Title

Impact of fabrication process on electrical properties and on interfacial density of states in 4H-SiC n-MOSFETs studied by hall effect

Other Title
Einfluss des Fabrikationsprozesses auf die elektrischen Eigenschaften und die Konzentration von Zuständen an der Grenzschicht in 4H-SiC n-MOSFETs aus Halleffektuntersuchungen
Abstract
In this work, electrical properties of lateral n-channel MOSFETs implanted with different nitrogen doses in the channel region were measured by Hall-effect technique at 300K. A mobility improvement with increasing nitrogen implantation doses is observed. Interface trap density (Dit) was determined from the experimentally measured Hall carrier density. Our results show a high Dit near and within the conduction band that does not change significantly when the nitrogen implantation dose is increased, despite observed mobility improvement.
Author(s)
Ortiz, Guillermo
LAAS-CNRS
Mortet, Vincent
LAAS-CNRS
Strenger, Christian
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Uhnevionak, Viktoryia
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Burenkov, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Bauer, A.J.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Pichler, Peter  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Cristiano, Fuccio
LAAS-CNRS
Bedel-Pereira, Elena
LAAS-CNRS
Mainwork
HeteroSiC & WASMPE 2013  
Project(s)
MobiSiC
Funder
Bundesministerium für Bildung und Forschung BMBF (Deutschland)  
Conference
International Workshop on Silicon Carbide Hetero-Epitaxy (HeteroSiC) 2013  
Workshop on Advanced Semiconductor Materials and Devices for Power Electronics Applications (WASMPE) 2013  
DOI
10.4028/www.scientific.net/MSF.806.127
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • 4H-SiC MOSFETs

  • hall mobility

  • inversion carrier density

  • density of interface traps

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