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Fraunhofer-Gesellschaft
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  4. Fraunhofer cluster 3D integration - key to a holistic technology and service approach
 
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2014
Conference Paper
Title

Fraunhofer cluster 3D integration - key to a holistic technology and service approach

Abstract
3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.
Author(s)
Wolf, Jürgen M.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schulz, Stefan  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Schneider, Peter  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Zschech, Ehrenfried
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
Smart Systems Integration 2014  
Conference
Smart Systems Integration Conference (SSI) 2014  
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2014  
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • 3D integration

  • design

  • TSV technology

  • analytics

  • reliability

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