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  4. Silicon carbide in power electronics: Overcoming the obstacle of bipolar degradation
 
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2014
Presentation
Title

Silicon carbide in power electronics: Overcoming the obstacle of bipolar degradation

Title Supplement
Presentation held at TMS Annual Meeting 2014 at San Diego, California, February 16-20, 2014; invited talk
Other Title
SiC in Power Electronics: Overcoming the obstacle of bipolar degradation
Abstract
Silicon Carbide (4H-SiC) is an ideal semiconductor for energy efficient power conversion modules. In recent years, unipolar SiC devices have been conquering the power electronics market. Contrarily, the commercialization of bipolar SiC devices has been hindered by the so-called bipolar degradation, which is closely related to the existence of certain structural defects within the active device volume. It will be shown how these critical defects can be avoided by optimizing the epitaxial growth of the active device volume. Furthermore, it will be proven that the absence of critical defects in the device prevents bipolar degradation. As the root cause of bipolar degradation is solved now, we also present remaining challenges for the commercialization of bipolar devices such as the cost reduction by enhancing the epitaxial growth rate and the improvement of device characteristics by increasing the minority carrier lifetime.
Author(s)
Kallinger, Birgit  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Ehlers, Christian
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Berwian, Patrick  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Friedrich, Jochen  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rommel, Mathias  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Project(s)
KoSiC
SiC-WinS
Funder
Bayerische Forschungsstiftung BFS  
Bayerische Forschungsstiftung BFS  
Conference
The Minerals, Metals and Materials Society (TMS Annual Meeting and Exhibition) 2014  
DOI
10.24406/publica-fhg-384017
File(s)
003.pdf (1.22 MB)
Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • power electronics

  • silicon carbide

  • defects

  • stability

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